H-Pin^® Technology
US Patent #7025602

Plastronics developed a new series of high performance, compliant contacts to serve high volume applications that require reliable electrical, mechanical, and thermal interconnect with program enabling manufacturability.

The H-Pin^® is a stamped contact with probe pin performance providing a robust contact solution for burn-in, programming, and system level applications.

High Volume Manufacturing
Utilizing high volume BeCu stamping technology, combined with a stainless steel spring for mechanical travel, the H-Pin^® has a working range up to 0.70 mm with a flat spring rate, can be utilized up to 15GHz with -1.0dB loss, carry up to 4 amps of current and withstand temperatures up to 200°C. Automation has been developed to assemble the contact pin onto a stamped lead frame. The lead frame may then be singulated for hand loading or left on the lead frame reel and placed into an automated loading system.

H-Pin^® Applications
Sockets and Interconnects for high-volume applications, featuring highly compliant contact elements with excellent mechanical, thermal, and electrical characteristics are here.

For the burn-in, programming, and system-validation markets (or other markets) that require 10,000+ insertions and thousands of sockets, the options are limited. The solution: The H-Pin^®.

H-Pin^® Features and Benefits
The H-Pin^® is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe and the ease of use and high volume manufacturability of a stamped contact. The H-Pin^® serves applications without the typical compromises that are generally required when considering cost versus performance.

Features	Benefits
0.40 mm to 0.70 mm Travel	Compliancy for Large Package Warpage
Flat Spring Rate	Stable Contact Resistance and Force
BeCu H-Pin®	Solid Beam Electrical Performance
Stainless Steel Core Spring	Compliancy at High Temperatures (180°C)
Bandwidth -1dB @ 15GHz	Correlated BI, System Evaluation and Test
Current Carrying Capacity	Reliable Power and Ground Contact
High Volume Stamping *	Stocked Inventory and Better Lead Time
Automated Pin Assembly *	High Volume Capacity and Quality Control
Reel-to-Reel Pin Insertion *	High Volume Capacity and Ease of Use

* Production Tours available upon request for qualified programs

H-Pin^® Data
(Internal Testing - Results may vary per application)
MECHANICAL PROPERTIES:

Pitch:	0.50 mm to 1.00 mm
Full Travel:	0.40 mm to 0.70 mm
Operating Temperature:	-30°C to +180°C
Mechanical Life:	100,000+ cycles

ELECTRICAL PROPERTIES:

Contact Resistance:	30mΩ to 40mΩ max
Current Rating:	2 amp to 4 amp (free air)
Bandwidth @ -1dB:	Up to 15.0 GHz

MATERIALS:

Stamped Contact:	BeCu, Au Plate
Spring:	SS, Au Plate

OPTION DESIGNS:
- Tip Styles: Conical, V-notch, U-notch
- Mounting Styles: Compression or Through-hole

1.00 mm H-Pin®	0.80 mm H-Pin®	0.50 mm H-Pin®
For Reference Only	For Reference Only	For Reference Only

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