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H-Pin® Technology Plastronics developed a new series of high performance, compliant contacts to serve high volume applications that require reliable electrical, mechanical, and thermal interconnect with program enabling manufacturability. The H-Pin® is a stamped contact with probe pin performance providing a robust contact solution for burn-in, programming, and system level applications. High Volume Manufacturing Utilizing high volume BeCu stamping technology, combined with a stainless steel spring for mechanical travel, the H-Pin® has a working range up to 0.70 mm with a flat spring rate, can be utilized up to 15GHz with -1.0dB loss, carry up to 4 amps of current and withstand temperatures up to 200°C. Automation has been developed to assemble the contact pin onto a stamped lead frame. The lead frame may then be singulated for hand loading or left on the lead frame reel and placed into an automated loading system. H-Pin® Applications Sockets and Interconnects for high-volume applications, featuring highly compliant contact elements with excellent mechanical, thermal, and electrical characteristics are here. For the burn-in, programming, and system-validation markets (or other markets) that require 10,000+ insertions and thousands of sockets, the options are limited. The solution: The H-Pin®. H-Pin® Features and Benefits The H-Pin® is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe and the ease of use and high volume manufacturability of a stamped contact. The H-Pin® serves applications without the typical compromises that are generally required when considering cost versus performance.
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